ProPak India 2018 and Fi India & Hi 2018 get off to a scintillating start


UBM India recently organised 13th edition of the Food Ingredients & Health Ingredients (Fi India & Hi) as well as the debut edition of ProPak India – a B2B platform for the packaging and processing industry for the first time at the India Expo Centre, Greater Noida from August 30 – September 01, 2018.

While Fi India & Hi, the only B2B event in the Indian sub-continent for the food and health ingredients, and processing & packaging industry, is one of the organisation’s oldest shows, the nouveau entrant, ProPak India is being co-located with the former due to the synergy between the two. Combined together, the shows are optimally positioned to provide industry players an entire array of products and solutions pertaining to food ingredients, processing, technology and packaging under one giant umbrella. ProPak India also brings within its ambit, packaging solutions pertaining to products from medicines, cosmetics, appliances, industrial systems and machinery, among others.

The co-located expos will rotate annually between India’s two promising food hubs i.e Mumbai and the Delhi-NCR region.

Speaking on the occasion of the launch of Fi India & Hi as well as ProPak India, Yogesh Mudras, Managing Director, UBM India said, “In India, the food sector has emerged as a high-growth and high-profit sector due to its immense potential for value addition, particularly within the food processing industry. It is set to be valued at US$65.4 billion by the end of 2018. Research also reveals that better processing and packaging techniques need to be developed that not only increase the shelf life but also improve the nutritive value of the processed food. And this is where our new ProPak India Expo comes in.  Of course, processing and packaging engulfs so much more and unlike corresponding expos in the sector, ProPak India will cater to multiple sectors and cater to the entire value chain and be of immense value.”

The maiden edition of the ProPak India Expo was launched in the presence of key industry dignitaries including Prof. Pierre Pennar, President – World Packaging Organisation; AVPS Chakravarthi, Global Ambassador – World Packaging Organisation, Yogesh Mudras, Managing Director, UBM India and Rahul Deshpande, Group Director, UBM India, among other dignitaries.

Catering to India’s ever growing processing and packaging industries, the show has been geo-located from ProPak, Asia’s largest platform in its domain, and is comprehensively tailored to Indian requirements.

Unlike corresponding expos in the sector, ProPak India caters to packaging and processing in multiple sectors. Accordingly, the show hosted over 80 companies offering products and services in automation, testing and measurement, filing and sealing machinery, cartooning machinery, thermoforming, robotics, storage and transport, materials and consumables, and complete production lines along with allied services.

Some of the key exhibitors at the show included Clearpack India, IWK Thailand, Bossar Packaging, Bry Air Asia, Ishida India, Gandhi Automations, Ace Technologies, Goma Engineering, IMA-PG, among a host of others.  The show benefited manufacturers, distributors, Govt institutions, and other key professionals associated with Product Development, R&D, QC/QR labelling, Packaging Development, Procurement, Supply Chain, purchasing, and Marketing and helps them network, exchange ideas on trends and solutions, and conduct business under one address.

Alongside the exhibition, ProPak India 2018 also featured an engaging and interactive conference on extremely topical subjects. Day 1 comprised The Leaders Panel – Industry 4.0; Smart Technologies In Liquid Food & Beverage Industry; Plastic Waste Control And Solid Waste Management; Ecommerce Packaging – The New Opportunity while Day 2 veered on topics like Plastics – Is the angst against the material realistic or mis-placed?; Challenges & Opportunities in Packaging Design and Innovation; Women in Processing and Packaging Industry and other panel discussions.

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