BOBST Group and SEI Laser join forces to accelerate the development of digital laser cutting solutions for the label and packaging industry. The synergies between the two companies will enable to develop new solutions and approaches answering the needs of our clients. The new activity will develop and commercialise worldwide digital laser cutting solutions for the labels, flexible packaging, folding carton and corrugated board industries. Once all required approvals will have been obtained, BOBST Group will provide more information, continuing to shape the future of the packaging world.
